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McBride wins IEEE Best Paper Award

Published: 
8 November 2016
Prof. John W. McBride
Among his many accomplishments, Prof. McBride completed projects worth in excess of £7.5Million

Prof. John W. McBride, Chief Executive Officer of the University of Southampton Malaysia Campus, has been named the 2015 recipient of the Best Paper Award for the IEEE Transactions on Components, Packaging and Manufacturing Technology in the Components: Characterisation and Modeling category.

 

McBride, along with Prof. Liudi Jiang of Materials and Electromechanical Systems within Engineering and the Environment at Southampton and post-doctoral research fellow Adam P. Lewis, received the honour for their paper entitled ‘‘Evolution of Voltage Transients during the Switching of a MEMs Relay With Au/MWCNT Contacts,’’ which was published in the December 2015 edition of the journal.

The paper presents a method for improving the lifetime of gold as the electric contact material for microelectromechanical systems (MEMS) metal contact switches. This procedure consists of developing a gold-coated multi-walled carbon nanotube bilayer composite with experiments under two different hot switching conditions – a higher load current of 50 mA and a lower load current of 10 mA. The paper showed that stable contact resistance throughout the contact lifetime can be achieved under lower load current of 10 mA and over 500 million switching cycles. Click here to view and download the paper.

‘’Using a combination of design and experimental methodologies, we found that gold-coated multi-walled carbon nanotube bilayer composite as a contact can withstand the damage caused by hot switching,’’ said McBride. ‘’This work will enable us to make future MEMS more reliable and energy efficient.’’

Prior to joining University of Southampton Malaysia Campus, McBride was the Associate Dean of Research in University of Southampton’s Faculty of Engineering and the Environment. As a lecturer in Mechanical and Electrical Engineering, he specialised in electrical and contact physics and surface characterisation.

In 2006, he was awarded the IEEE Holm Scientific Achievement Award, an international award recognising outstanding scientists and engineers in the field of electrical contacts or related technologies. Two years later, he was team leader for the award of the international James A Lindner Prize for research on the ‘’Sound Archive Project’’.

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

 

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