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The University of Southampton
University of Southampton Malaysia

Research project: Novel electrical packaging manufacturing techniques

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Recent advances in manufacturing techniques have opened up many new opportunities for improving electrical package design. Technologies such as: 3d printing (AKA rapid prototyping or solid freeform fabrication), laser welding, laser drilling and new metal deposition techniques are maturing and offer many new possibilities. These techniques could allow fully-functional prototypes of electronic equipment to be designed and built in hours, rather than days or weeks, yet have vastly superior performance in terms of mechanical, thermal, environmental and design properties.

This very exciting and innovative project will aim to develop and validate these technologies and create an initial working manufacturing device that demonstrates the feasibility of rapid electronic manufacturing. There will be a significant amount of experimental work involved.

The work will be relevant for electronics used in extreme environments: spacecraft launch, car computer systems, military grade electronics, aerospace electronics, robust consumer electronic devices, etc.

Applicants should have a background in materials or manufacturing engineering. Experience in any of the following areas is also particularly welcome: solid freeform fabrication, testing of polymer’s electrical properties, wire bonding, electronic equipment manufacture, CVD, laser welding and metal sintering.

The successful applicant will work in the new University of Southampton Malaysia campus, as part of the new group of experienced researchers and academics. There will be a significant amount of expertise and facilities available to assist you in your research.

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