Skip to main navigationSkip to main content
The University of Southampton

Research project: Graphene reinforced lead-free solder composites

Currently Active: 

Tin whisker growth on lead-free solder of copper-based conductors is a serious reliability problem in electrical and electronic devices. The growth of tin whisker can be spontaneous and an irreversible process. Some whiskers can grow to several hundred microns in length, which are long enough to cause electrical-shorting leading to the failure of electrical and electronic devices. Examples of failures have been seen in commercial satellite, electronics in aeroplanes, reactors, heart pacemaker, consumer electronics, etc.

Project Overview

The work focuses on obtaining an optimum weight percentage of grapheme in a composite that would stop tin whiskers growth when electroplated. Electroplating process parameters may include current density, temperature of the electrolyte, composition of tin salt, flow condition, surfactants and additives technologies.

The new composite will be subjected to a simulated environment to grow whiskers. Tests will be carried out to compare a plain tin, tin-graphite and tin-carbon nanotubes composites.

Associated research themes

Materials and surface engineering


Key Publication


Share this research project Share this on Facebook Share this on Google+ Share this on Twitter Share this on Weibo

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we will assume that you are happy to receive cookies on the University of Southampton website.