About the project
Reliable optical connections are essential to scaling photonic systems. This project will develop a foundry-compatible platform for low-loss, high-density, pluggable optical interfaces. It will combine broadband edge couplers, passive alignment and wafer-level testing to establish repeatable connections for optical interconnects and photonic packaging.
Optical packaging is a critical barrier to scaling integrated photonics. High-density interfaces must provide low coupling loss while accommodating fabrication and assembly tolerances. For pluggable connections, these requirements must also be maintained through repeated attachment and detachment.
This project aims to establish a foundry-compatible optical I/O platform that integrates device design, connector architecture and packaging. The central research question is how optical mode engineering and passive alignment can deliver repeatable, low-loss connections (<1dB per fibre) at high interface density.
The research will develop broadband edge couplers with expanded optical modes and evaluate the trade-offs between coupling efficiency, bandwidth, footprint and alignment tolerance. These designs will be integrated with fibre arrays and expanded-beam interfaces to investigate detachable connector architectures. Optical simulation, fabrication and experimental characterisation will establish the effects of process variation, assembly errors and repeated mating on performance.
Wafer-level optical testing will be investigated alongside packaging methods to support reproducible device screening and assembly. A prototype interface will validate coupling loss, operating bandwidth, alignment tolerance and connection repeatability.
The expected contribution is a set of experimentally validated interface designs and testing methods that provide a route towards scalable photonic packaging. The platform will address optical connectivity requirements in pluggable modules, near-packaged optics and co-packaged optics with collaborating with ORC fiber group.
Comprehensive training will be provided in photonic and optical modelling using Ansys Lumerical, COMSOL Multiphysics and Zemax, alongside full equipment training in the University of Southampton’s cleanroom facilities. You'll also receive hands-on training in optical measurements and silicon photonic chip testing, including optical alignment, fibre-to-chip coupling and device characterisation. Together, these activities will develop the skills required to design, fabricate and experimentally validate integrated photonic devices.
The School of Optoelectronics (ORC) is committed to promoting equality, diversity inclusivity as demonstrated by our Athena SWAN award. We welcome all applicants regardless of their gender, ethnicity, disability, sexual orientation or age, and will give full consideration to applicants seeking flexible working patterns and those who have taken a career break. The University has a generous maternity policy, onsite childcare facilities, and offers a range of benefits to help ensure employees’ well-being and work-life balance. The University of Southampton is committed to sustainability and has been awarded the Platinum EcoAward.
